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Steel mesh is a hole plate. In SMT technology, solder paste is transferred to the pads of the circuit board using the screen printing technology. The holes on the steel mesh have two functions: one is to serve as a microchannel for solder paste transfer, so the side walls are required to be smooth and flat, and there is a certain taper with a small top and a large bottom, which is conducive to the separation of solder paste. The second is to accurately position the solder paste on each pad of the circuit board, so the hole position accuracy and hole shape accuracy are required to be high.

Corresponding to the pads of the circuit board, the number of holes on an ordinary steel mesh is usually hundreds or thousands, and the more complex ones can reach tens of thousands; moreover, the size of each hole itself and the distance between the holes are very small, and holes with a diameter of one or two hundred microns are becoming more and more common; the special thing is that the size and spacing of the holes are so small, but the shapes are varied, including circles, rectangles, rectangles with certain geometric shapes cut off or added, etc.

The functions and size characteristics of the above holes make the laser steel mesh processing technology different from the ordinary punching and cutting process, and require a high-speed, high-dynamic performance, and high-precision mobile control system between the laser processing head and the workpiece.

A high-energy-density, highly focused laser beam is projected onto the surface of the stainless steel foil. The light is quickly converted into heat energy, and under the joint action of the auxiliary gas, the material is melted and vaporized, carried away by the auxiliary gas, and cut through the material to form a cutting starting point. At this time, the laser beam moves relative to the predetermined route of the workpiece. With the assistance of the compressed gas combustion-supporting and discharge functions, the material is continuously melted and vaporized and discharged, and finally a solder paste leak hole is processed.